ASUS PRIME Z690-P D4 ATX Motherboard

ASUS PRIME Z690-P D4 ATX Motherboard
Brand: Asus
184.98 GBP
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Features • Intel® LGA 1700 socket: Ready for 12th gen Intel® processors • Enhanced power solution: 14+1 DrMOS, 8+4 pin ProCool connector, alloy chokes and durable capacitors for stable power delivery • Comprehensive cooling: Large VRM heatsinks, M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 4 • ASUS OptiMem II: Careful routing of traces and vias, plus ground layer optimizations to preserve signal integrity for improved memory overclocking • Next-gen connectivity: DDR4, PCIe® 5.0, 2.5 Gb Ethernet, USB 3.2 Gen 2x2 Type-C®, front panel USB 3.2 Gen 1 Type-C®, Thunderbolt™ 4 header support VRM Heatsinks and High-quality Thermal Pads Two massive VRM heatsinks and high-quality thermal pads improve heat transfer from the MOSFETs and chokes for better cooling performance. Cooler by Design Prime Z690 series features comprehensive cooling controls that are configurable via Fan Xpert 4 software or via the UEFI BIOS. Multiple Temperature Sources Each header can dynamically reference three thermal sensors. Fan Xpert 4 allows you to map the temperature of supported ASUS graphics cards to optimize cooling for GPU- and CPU-intensive tasks. Prime Z690 series is built to handle the additional cores and increased bandwidth of 12th Generation Intel® processors. ASUS Z690 motherboards provide all the fundamentals to boost daily productivity, so your system will be ready for action with stable power, intuitive cooling and flexible transfer options. OptiMem II Revisions to the motherboard’s trace routing provide the latest Intel processors with unrestricted access to memory bandwidth. ASUS OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce vias and adds shielding zones that significantly reduce crosstalk. Benefits of ASUS OptiMem II: • Improved memory stability and compatibility • Allows lower memory latencies at equivalent voltages • Improved memory frequency margin Motherboards with OptiMem II technology were tested with Synopsys HSPICE simulation software Top layer – ground ring to prevent lateral interference