Features • Intel® LGA 1200 socket: Ready for 11th Gen Intel® Core™ processors • Enhanced power solution: 8+1 power stages, 6-layer PCB, ProCool socket, and durable capacitors for stable power delivery • Comprehensive cooling: VRM heatsink, flexible M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+ • Next-gen connectivity: PCIe 4.0, Realtek 2.5Gb Ethernet, rear USB 3.2 Gen 2, front USB 3.2 Gen 1 Type-C® and Thunderbolt™ 4 header support • Made for online gaming: Intel Wi-Fi 6, Realtek 2.5 Gb Ethernet, TUF LANGuard, and Turbo LAN technology • Two-way AI Noise-Cancelation: Reduce background noise from the microphone and audio output for crystal-clear communication in games or video conferences • ASUS OptiMem II: Careful routing of traces and vias to preserve signal integrity for improved memory stability Durable, Stable and Reliable Motherboard ASUS TUF GAMING B560M-PLUS comes in a Micro-ATX size and takes all the essential elements of the latest 10th and 11th gen Intel® Core™ Intel® 1200 socket processors. It also combines the Intel processors with game-ready features and proven durability with support for DDR4 memory. Engineered with military-grade components, an upgraded power solution and a comprehensive cooling system, this motherboard offers rock-solid, stable performance for marathon gaming. Aesthetically, TUF GAMING B560M-PLUS sports the new TUF Gaming logo, and incorporates simple geometric design elements to reflect the dependability and stability that defines the TUF Gaming series. DIGI+VRM The integrated Digi+ VRM voltage-regulator module (VRM) is one of the finest in the industry, ensuring ultra-smooth and ultra-clean power delivery to the CPU at all times. POWER DELIVERY ENHANCEMENTS With upgraded power delivery and comprehensive cooling options to drive the 11th and 10th Gen Intel® Core™ processors, plus support for faster memory and storage, TUF GAMING B560 series motherboards are the perfect foundation for your next high-core-count battle rig. The onboard VRM of TUF GAMING B560 series motherboards utilize 8+1 DrMOS power stages that combine high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that 11th Gen Intel Core processors demand. A multiple PCB layers shift heat away from critical components, providing more headroom to push CPUs beyond stock speeds. The motherboard also uses ProCool connectors that are built to tight specifications to ensure flush contact with PSU power lines. This results in lower impedance and helps to prevent hotspots and connector failure. Multiple temperature sources Each header can be set to monitor and react to three user-configurable thermal sensors for workload-based cooling, and all settings can be easily managed by Fan Xpert 4 or via the UEFI. DRAM Overclocking Performance Revisions to the motherboard’s trace routing provide the latest Intel processors with unrestricted access to memory bandwidth. ASUS OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce vias and adds shielding zones that significantly
